Assessment of AF4 Parylene Cohesion/Adhesion on Si and SiO2 Substrates by Means of Pull-Off Energy

Advanced packaging solutions require insulation and passivation materials with exceptional properties which can also fulfill the reliability needs of electronics devices such as MEMS, sensors or power modules. Since bonding (cohesive/adhesive) coatings are very important for reliable functioning devices, aliphatic fluorinate-4 (AF4) parylene was assessed in this work. As there is a lack data regarding its towards different substrates, pull-off tests 1.6 2.5 μm thick AF4 on silicon (Si) glass (SiO2) substrates were performed. These showed clear difference F/s curves between Si SiO2 substrates. This parameterized by energy, will be presented To further understand origin distinction energies AF4-Si AF4-SiO2 samples subsequently cohesive/adhesive properties, mechanical structural characterization conducted coatings, where E-modulus crystallinity observed. The wafers shown to facilitate CVD growth film distinctively, likely relates divergent thermal Understanding substrate advances usage technologies.